Committees

Conference Chair

L. Frey (Fraunhofer IISB, Germany)
 

Conference Co-Chair

R. Ploss (Infineon, Germany)
 

Technical Program Committee

Chair: V. Häublein (Fraunhofer IISB, Germany)

P. Chu  (Hong Kong City University, China)
A. Claverie  (CEMES/CNRS, France)
M.I. Current  (Current Scientific, USA)
R. Duffy  (Tyndall, Irland)
J. England (University of Surrey, UK)
D. Fuchs  (Infineon, Germany)
J. Gyulai  (KFKI, Hungary)
Y. Inouchi (Nissin Ion, Japan)
A. Jain  (Globalfoundries, USA)
F.A. Khaja  (Applied Materials, USA)
W. Lerch  (Centrotherm, Germany)
J. Matsuo  (Kyoto University, Japan)
S. Mehta  (AIBT, Taiwan)
J. Nieß  (HQ-Dielectrics GmbH, Germany)
P. Pichler  (Fraunhofer IISB, Germany)
L. Rubin  (Axcelis, USA)
W. Schustereder  (Infineon, Austria)
W. Skorupa  (HZDR, Germany)
M. Takai  (Osaka University, Japan)
C. Trautmann  (GSI, Germany)
W. Vandervorst  (IMEC, Belgium)

International Committee

Chair: K.S. Jones

P. Chu, Hong Kong
M.I. Current, USA
S. Felch, USA
D. Jacobson, USA
A. Jain, USA
M. Kase, Japan
L.A. Larson, USA
W.-H. Lee, Taiwan
J. Matsuo, Japan
D. Mous, Netherlands
H. Nariaki Japan
L. Pelaz, Spain
T. Renau, USA
L. Rubin, USA
G. Ryding, USA
H. Ryssel, Germany
W. Schustereder, Austria
E. Seebauer, USA
M. Sugitani, Japan
M. Takai, Japan
M. Taylor, USA
A. Vanderpool, USA
A. Vyatkin, Russia
Z. Wan, USA
J. Williams, Australia
A. Wittkower, USA
I. Yamada, Japan
J. Ziegler, USA

Local Organizing Committee

Chair: H. Ryssel (Fraunhofer IISB, Germany)

A. Wahl  (Fraunhofer IISB, Germany)
V. Häublein  (Fraunhofer IISB, Germany)
T. Richter  (Fraunhofer IISB, Germany)
G. Ebersberger  (Fraunhofer IISB, Germany)
A. Merkel  (University of Erlangen-Nürnberg)
K. Pöhlau  (Fraunhofer IISB, Germany)
B. Progscha  (Fraunhofer IISB, Germany)
M. Wittmann  (Fraunhofer IISB, Germany)
M. Zehendner  (Fraunhofer IISB, Germany)
E. Bär  (Fraunhofer IISB, Germany)
W. Appel  (IMS-Chips, Germany)
L. Ende  (X-FAB, Germany)
D. Fuchs  (Infineon, Germany)
J. Gyulai  (KFKI, Hungary)
U. Hase  (projects & solutions, Germany)
R. Kaspareit  (Applied, Germany)
K. Kerkel  (Infineon, Germany)
J. Krügener  (Leibniz Universität Hannover, Germany)
W. Lerch  (Centrotherm, Germany)
R. Riekeles  (Bosch, Germany)
A. Scheit  (IHP, Germany)
W. Schustereder  (Infineon, Austria)
W. Skorupa  (HZDR, Germany)
K.-H. Stegemann  (X-FAB, Germany)
S. Sun  (IMS-Chips, Germany)
M. Takai  (Osaka University, Japan)